
The Bottom Bump Tactile Switch is a unique tactile switch with a linear feel until near-bottom-out, featuring a tactile bump ~1mm before bottoming out and actuation upon full press. Currently in early IC stages, this project aims to fill a gap in the tactile switch market.
"Excited about the potential of the switch and willing to try it."
"Interesting concept, and appreciates the effort."
"Curious about the project and thinks it fills a gap in the switch market."
"Finds the idea novel and fun."
"Likes the concept of bottom bump tactile switches."
"Considers it a cool novelty and is eager to try it."
"Concerns about the actuation timing and potential issues for typists."
Consider selling stems separately to accommodate different travel preferences.
Get quotes on pricing beforehand for better planning.
Any ideas on which manufacturers will be consulted?
Why is Tecsee specifically being avoided?
The thread has 11 unique replies with a mix of excitement and curiosity about the project. Positive and neutral feedback outnumber negative feedback, indicating strong community interest. Overall engagement is high, and suggestions indicate community involvement in improving the project.